Investigation of Multicomponent Lead-Free Solders
نویسندگان
چکیده
منابع مشابه
A Comparison of Lead-Free vs. Eutectic Solders
T he use of lead in the electronics industry today accounts for approximately 7% of total lead consumption.' The single largest use of lead is in the manufacture of storage batteries, which accounts for 60% of the total lead produced.2 The use of lead is closely regulated in plumbing, paint and gasoline industries. Currently, the electronics industry has been exempted from the existing requirem...
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Ceramic capacitors have proven themselves very reliable with extremely low failure rates. As processes continue to improve, reliability of the dielectric also continues to increase. This increase in the reliability of the dielectric has caused other categories to emerge as the main contributors to the overall failure rate. A recent review of field failure analysis of surface mount MLCCs, has sh...
متن کاملNovel Rare-Earth-Containing Lead-Free Solders with Enhanced Ductility
Several lead-free material systems are available as replacements for traditional lead-based solders in microelectronic packaging, including near-eutectic combinations of tin-rich alloys. Although these materials have superior mechanical properties as compared to the Pb-Sn system, much work remains in developing these materials for electronic packaging. Small additions of rare-earth elements hav...
متن کاملCombined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders
In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and Ni metallizations. First, the effect of P on the interfacial reactions, and thus on the reliability, between Sn-based solders and electroless Ni/immersion Au (ENIG) metallizations, will be discussed. Next, the effect of ...
متن کاملIntermetallic Phase Formation and Thickness of Tin- Zinc Based Lead-free Solders
In this study the intermetallic (IMC) thickness of Sn-Pb, Sn-Zn and Sn-Zn-Bi solders on copper (Cu) substrate were measured at different temperatures using reflow methods. Cu6Sn5 intermetallic phase was detected between Sn-Pb solder and Cu substrate. The -Cu5Zn8 phase was detected between Sn-Zn and Sn-Zn-Bi lead-free solders with Cu substrate. The thickness of the intermetallics increases with ...
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ژورنال
عنوان ژورنال: Archives of Metallurgy and Materials
سال: 2017
ISSN: 2300-1909
DOI: 10.1515/amm-2017-0156